Search for patents, see patents for inventions
A crystal oscillator fabrication method includes depositing mounting cement onto first and second mounting pads on a substrate to thereby define first and second electrode adhesion bumps. First and second electrodes of a crystal oscillator are electrically connected to the first and second mounting pads by contacting the first and second electrodes to the first and second electrode adhesion bumps and then curing the adhesion bumps. Next, mounting cement is deposited onto the first electrode and onto a portion of the first electrode adhesion bump to thereby define a top electrode adhesion extension. The top electrode adhesion extension is then cured.
A high-frequency module includes a substrate, an integrated circuit mounted to the substrate, a cylindrical shield enclosing the integrated circuit to block radio waves, a casing provided on an opposite side of the substrate relative to the shield to block radio waves, and a choke portion provided in an inner wall of the casing, the inner wall being opposed to the shield, or provided in the substrate, with a predetermined gap being formed relative to the shield, to create an antiphase in radio waves having a predetermined frequency emitted from the integrated circuit into a space above the substrate.
An information handling system when operational has compute components held by a lightweight server chassis. For both shipping and operational support, the LWS chassis is inserted into a casing that is laterally sized to prevent lateral movement of the server chassis. The casing is formed of an impact tolerant material to protect the server chassis and any functional compute components inserted within the server chassis. In addition, the casing has sealable flaps that enable the server chassis to be fully enclosed within the casing. Thereby, the casing can be utilized as an external shipping carton in which the IHS can be physically shipped to a destination.
An electronic component case for a vehicle is provided. The electronic component case includes a case body having a first space in which electronic components are disposed and a second space, which has an opening that is opened to the outside, defined adjacent to the first space to receive heat generated from the electronic components, wherein a coolant for cooling the electronic components is introduced into and discharged from the second space, and a cover disposed on the case body to seal the opening of the second space. The cover includes a first cover sealing the opening and a second cover sealing the opening and having one surface on which a first cooling part for increasing a surface area of the second cover is disposed. The first cover and the second cover are compatible with each other.
An improved capacitor packaging solution is presented that incorporates both thermal and electrical considerations. A package can include capacitor elements electrically coupled to a bus bar, and a thermally enhanced isolation layer between the bus bar and a case. The isolation layer can be provided adjacent a case base and sidewall portions. The bus bar can be disposed adjacent the isolation layer and be configured to extend along the package side and along the package length below the capacitor elements to provide an extended path for heat dissipation from the bus bar prior to its contact with capacitor elements. The enhanced isolation layer is configured to conduct heat away from the bus bar to the case to avoid the hotspot temperature of the capacitor. Reduced capacitor temperature allows use of smaller, cheaper capacitors, reducing inverter costs without compromising performance.
A data center system includes a housing to house servers arranged in electronic racks and an air supply system to receive contaminated air from an external environment of the housing. The datacenter system further includes a misting and cooling system to clean and cool the contaminated air. The misting and cooling system includes a cooling and cleaning chamber to receive the contaminated air and nozzles to spray liquid droplets into the contaminated air within the cooling and cleaning chamber. The liquid droplets collect and remove at least a portion of the particles contained in the contaminated air to generate non-contaminated air. The data center system further includes an airflow delivery system to generate an airflow from the non-contaminated air to cause the airflow to travel through the servers of the electronic racks to exchange heat generated by the servers due to operations of the servers.
This discloses apparatuses for cooling individual server racks or electrical enclosures. These devices maintain target enclosure temperatures within plus or minus 1 or 2 degrees F. The devices employ industrial cooling using staged cooling towers to evaporatively reach temperatures below the wet bulb temperature of the ambient air. Methods for using such apparatuses are disclosed as well.
Input data, specifying aspects of a thermal design of a liquid cooled data center, is obtained. The input data includes data indicative of ambient outdoor temperature for a location of the data center; and/or data representing workload power dissipation for the data center. The input data is evaluated to obtain performance of the data center thermal design. The performance includes cooling energy usage; and/or one pertinent temperature associated with the data center. The performance of the data center thermal design is output.
This application relates to efficiently distributing heat within a portable computing device. More specifically an apparatus for conducting heat between internal components of the portable computing device is disclosed. The apparatus, referred to as a thermal gap pad, is configured to bridge a variably sized gap between internal components. This is accomplished by wrapping a resilient core in a layer of highly thermally conductive material. The resilient core allows a shape of the thermal gap pad to vary in accordance with a size of the gap. A resilience of the thermal gap pad can be adjusted to account for an amount of variance in the gap. In some embodiments, an electrically conductive layer can be added to facilitate the passage of electrical current through the thermal gap pad.
Power electronics modules having modular jet impingement assembly utilized to cool heat generating devices are disclosed. The modular jet impingement assemblies include a modular manifold having a distribution recess, one or more angled inlet connection tubes positioned at an inlet end of the modular manifold that fluidly couple the inlet tube to the distribution recess and one or more outlet connection tubes positioned at an outlet end of the modular manifold that fluidly coupling the outlet tube to the distribution recess. The modular jet impingement assemblies include a manifold insert removably positioned within the distribution recess and include one or more inlet branch channels each including an impinging slot and one or more outlet branch channels each including a collecting slot. Further a heat transfer plate coupled to the modular manifold, the heat transfer plate comprising an impingement surface including an array of fins that extend toward the manifold insert.
In a power supply device 1, a first space R1 and a second space R2 are delimited, a coil component 20 is arranged in the first space R1, and heat-generating components and components having weak resistance to heat are arranged in the second space R2. The power supply device 1 is configured to contain the coil component 20 in the first space R1 so that ambient air of the coil component 20 can contact a first side wall 72, which constitutes the first space R1, making it possible to expect discharge of heat to coolant in a coolant channel W via the first side wall 72. Therefore, heat can be discharged from the ambient air of the coil component, the temperature of which has been raised by heat generation, towards the coolant efficiently.
In some embodiments, a cooling system for an induction charger includes a thermal conditioning module in fluid communication with an induction charging assembly, which includes a dock and an induction charging module. The dock can be configured to receive a portable electronic device, such as a cell phone, that is configured to accept inductive charging from the induction charging module. The thermal conditioning module can include a fan or other fluid encouraging assembly, ducting, and a thermoelectric device . A fluid, such as air, can flow from the fan and across and/or through the thermoelectric device, thereby conditioning the fluid. The conditioned fluid can be provided to the dock to at least partially offset the heat generated by the inductive charging and/or the portable electronic device.
The invention relates to an electronic assembly comprising a plurality of electronic component groups and a cooling device for cooling the electronic component groups. The cooling device provides a cooling-power distributor. A cooling power of the cooling device can be individually controlled by the cooling-power distributor for every component group. Furthermore, the assembly provides temperature-registering means for every component group for registering a temperature of every component group, and a load-determining device for determining a parameter for every component group which describes the load experienced by a component group on the basis of the temperature registered for this component group. A control unit controls the cooling-power distributor on the basis of the parameters determined for the component groups.
A novel structurally-embedded construction, design, and maintenance record data management system and a related method of operation provide immediate and on-the-property access to construction, design, and maintenance records that are electronically stored and updated in an electronic archive of the structurally-embedded construction, design, and maintenance record data management system. An authorized personnel who is physically on the property of a building, a bridge, a monument, or another construction structure for maintenance or improvement work, even after a natural disaster event, can readily access and update a history of construction, design, and maintenance records on-site. The extensive time, efforts, and expenses in tracking down various documents and information associated with a particular construction structure can be dramatically reduced, if the novel structurally-embedded construction, design, and maintenance record data management system is utilized.
The present disclosure relates to an electronic card connection device and an electronic device. The electronic card connection device comprises a connector, an electronic card tray and a switch. The connector comprises a terminal housing and a shell, the shell and the terminal housing define a mating space. The electronic card tray being inserted in the mating space, the electronic card tray may comprise an electronic card receiving recess, a mounting block positioned in front of the electronic card receiving recess and an operating handle pivotally connected to the mounting block. The switch may be positioned alongside a rotation range of the operating handle, and partially protrudes into the rotation range allowing rotation of the operating handle to switch the state of the switch.
A method of manufacturing a thick-film electrode comprising steps of: applying a conductive paste onto a substrate comprising, 100 parts by weight of a conductive powder, wherein the conductive powder is 16 to 49 weight percent based on the weight of the conductive paste; 0.5 to 10 parts by weight of a metal additive comprising bismuth ; 1 to 25 parts by weight of a glass frit; and 50 to 300 parts by weight of an organic medium; and firing the applied conductive paste to form the thick-film electrode, wherein thickness of the thick-film electrode is 0.5 to 15 μm.
Disclosed is a display device and an apparatus for side surface sealing of display panel, which enable to realize thin profile and good exterior appearance in device, wherein the display device includes a display panel including a first substrate with pad regions, a second substrate bonded to remaining portions of the first substrate except the pad regions, and an upper polarizing film attached to an entire upper surface of the second substrate; a panel support member joined to an edge of a lower surface of the display panel; a panel driving part including a flexible circuit film attached to the pad regions; and a side surface sealing member for covering each side surface of the display panel, the flexible circuit film, the plurality of pad regions, and each side surface of the upper polarizing film.
A method includes creating an opening in a first outer layer of a multilayer sheet of material, the sheet of material having three or more layers of material, including the first outer layer and a second outer layer. A selective etchant is introduced through the opening, where the etchant selectively etches an interior metal layer of the multilayer sheet of material compared with the first and second outer layers. The selective etchant is permitted to etch material of the interior metal layer under the first outer layer.
An electrical box may include a housing body, enclosing a cavity, which includes an access opening extending across a first plane of the housing body, and which includes a plurality of mounting outlets configured to enable electrical devices to be mounted to the housing body to face a plurality of different directions. The electrical box may further include one or more mounting brackets attached to the housing body and a cover plate shaped to match and cover the access opening of the housing body. The housing body may include a first side wall and second side wall aligned to form an inside corner of the housing body, wherein the inside corner of the housing body is configured to align with an outside corner of a building or a structure, and wherein the first side wall and the second side wall are perpendicular to the first plane.
A circuit box includes a housing having an internal compartment. The housing includes first and second entrances for receiving first and second electrical wires, respectively, into the internal compartment. The housing includes first and second wire receptacles that include first and second dielectric shells, respectively, and first and second contacts, respectively, that are held by the first and second dielectric shells, respectively. The first and second contacts are electrically connected together. The first and second dielectric shells include first and second cavities that include pluggable interfaces that are configured to mechanically receive first and second wire terminals, respectively, that terminate the first and second electrical wires, respectively, such that the first and second contacts mechanically mate with the first and second wire terminals, respectively. A circuit element is held within the internal compartment of the housing. The circuit element is electrically connected to the first and second electrical wires.
A display device includes a display used to display an image, and a handle attached to a recess formed in a rear face of the display . The handle having a Z-shape in a side view connects between a first holder and a second holder via a connecting part . The second holder is projected outside the display device so as to achieve an easy-to-hold ability when the first mounting face of the first holder is fixed to the recess of the display device . The first holder is kept inside the thickness of the display device when the second mounting face of the second holder is fixed to the recess .
The present invention is to provide a holder having an adjustable clamping orientation, which includes a clamping assembly having a first clamping plate extended forwardly from a front end thereof and movably connected with a second clamping plate to form a clamping head for clamping a plate, a support assembly having a front end pivoted to a rear end of the clamping assembly and a side edge pivoted to a support arm extended therefrom so that a free end of the support arm is rotatable in a direction of away from or close to the clamping assembly, and a holding seat having a front end rotatably fastened with a rear end of the support assembly and a positioning member disposed at a rear end thereof, so that a mobile electronic device can be firmly positioned at the positioning member and adjusted to an expected orientation with respect to the plate.
There is provided a manufacturing method of a layered circuit board in which a first board and a second board are layered. The method includes arranging an adhesive resin sheet on the first board so that one face faces the first board, the adhesive resin sheet including a plurality of variant via holes, an opening area on the one face of each of the plurality of variant via holes being larger than an opening area on the other face, filling the variant via holes with conductive paste, arranging the second board on the other face of the adhesive resin sheet after the filling with the conductive paste, and performing heat press treatment to apply pressure to the adhesive resin sheet in a layering direction of the first board and the second board under heat.
The present invention relates to a galvanic process for filling through-holes with metals. The process is particularly suitable for filling through-holes of printed circuit boards with copper. The process comprises the following steps: formation of a narrow part in the center of a through-hole by electroplating; and filling the through-hole obtained in step with metal by electroplating.
An objective of the present invention is to provide a three-dimensional backplane to solve the problem that the number of layers of a printed circuit board for producing a backplane increases linearly along with the number of connectors. The three-dimensional backplane includes: a first group of connectors, a second group of connectors, a first group of printed circuit boards, and a second group of printed circuit boards. Any printed circuit board in the first group of printed circuit boards is connected to any printed circuit board in the second group of printed circuit boards. Any connector in the second group of connectors is connected to any connector in the first group of connectors. With the foregoing solution, the number of wires on each printed circuit board is reduced, so that the number of layers of a printed circuit board for producing a backplane is reduced.
A solder alloy is a tin-silver-copper solder alloy, and contains tin, silver, copper, bismuth, nickel, and cobalt. Relative to the total amount of the solder alloy, the silver content is 2 mass % or more and 4 mass % or less, the nickel content is 0.01 mass % or more and 0.15 mass % or less, and the cobalt content is 0.001 mass % or more and 0.008 mass % or less.
A mechanism is provided for packaging a multiple socket, one-hop symmetric multiprocessor topology. The mechanism connects each of a first plurality of processor modules to a first multiple-socket planar via a respective one of a first plurality of land grid array connectors. The mechanism connects the first multiple-socket planar to a first side of a redistribution card via a second plurality of LGA connectors. The mechanism connects each of a second plurality of processor modules to a second multiple-socket planar via a respective one of a third plurality of LGA connectors. The mechanism connects the second multiple-socket planar to a second side of the redistribution card via a fourth plurality of LGA connectors.
Embodiments of the present invention provide a preparation method of a patterned film, a display substrate and a display device, avoiding falling off of a film layer occurring in the process of peeling off a photoresist layer. The preparation method of the patterned film comprises: forming a preset film layer on a surface of a preset substrate; covering the preset film layer with an isolation layer; forming a photoresist layer on a surface of the isolation layer and forming a pattern of the isolation layer with a patterning process; then removing the preset film layer which is not covered by the pattern of the isolation layer, peeling off the photoresist layer and removing the remaining, isolation layer to form a pattern of the preset film layer.
Disclosed is a rotary conveying equipment for exposing a substrate. The rotary conveying equipment includes a carrying device and a rotary moving device. The carrying device carries the substrate by fastening the substrate thereon. The rotary moving device includes a rotating means, and the rotating means is connected to the carrying device and is moved together while rotated. And the efficiency of the exposure process is improved.
Disclosed are a method of manufacturing a metal wiring buried flexible substrate and a flexible substrate manufactured by the same. The method includes coating a sacrificial layer including a polymer soluble in water or an organic solvent, or a photodegradable polymer on a substrate , forming a metal wiring on the sacrificial layer in Step 1 , forming a metal wiring buried polymer layer by coating a curable polymer on the sacrificial layer including the metal wiring formed thereon in Step 2 and curing and separating the polymer layer in Step 3 from the substrate in Step 1 by removing through dissolving in the water or the organic solvent or photodegrading only the sacrificial layer present between the substrate in Step 1 and the polymer layer in Step 3 .
A carrier device for an electrical component includes a carrier, which includes an electrically insulating layer, and an electrical contact layer on the electrically insulating layer The electrical contact layer includes at least one bridge-shaped contact region At least one recess in the electrically insulating layer is arranged at least on one side surface of the bridge-shaped contact region and/or the bridge-shaped contact region includes a bridge width reducing toward the insulating layer.
A flexible circuit connecting device is disclosed, including a base layer having a first surface and a second surface, and conductive traces having a grid-like structure and formed on the first surface and/or the second surface. The conductive traces of the above flexible circuit connecting device are nearly aligned with the base layer, and thus the probability of damage under a stress is reduced. Designed to be a grid-like structure, the conductive traces become more transparent, while satisfying a function of a connector. Besides, the above flexible circuit connecting device has a high density circuit trace, so that the size of the connector can be reduced and the interior space of the electronic components can be saved. In a manufacture process of the above flexible circuit connecting device, the manufacture process can be simplified, manufacture efficiency and production yield can be improved, and manufacture cost can be efficiently reduced.
An electrically conductive composition, containing an electrically conductive polymer, and an onium salt compound as a dopant to the electrically conductive polymer, an electrically conductive film formed by shaping the composition and a method of producing the electrically conductive film.
The epoxy resin composition according to one embodiment of the present invention contains an epoxy compound, a curing agent, and an inorganic filler, wherein the inorganic filler contains spherical alumina .
According to one embodiment of the present invention, an epoxy resin composition comprises an epoxy compound, a curing agent, and an inorganic filler, wherein the inorganic filler includes alumina and aluminum nitride .
The epoxy resin composition according to one embodiment of the present invention contains an epoxy compound, a curing agent, and an inorganic filler, wherein the inorganic filler contains alumina and boron nitride .
A semiconductor device includes a first ceramic substrate, a second ceramic substrate, an inter-ceramic metal having an intermediate portion interposed between an upper surface of the first ceramic substrate and a lower surface of the second ceramic substrate, a first surmounting portion formed on an upper surface of the second ceramic substrate, a second surmounting portion formed on the upper surface of the second ceramic substrate, a first connection portion abutting on an outer edge of the second ceramic substrate and connecting the intermediate portion and the first surmounting portion, and a second connection portion abutting on an outer edge of the second ceramic substrate and connecting the intermediate portion and the second surmounting portion, a circuit pattern formed on the second ceramic substrate, and a semiconductor element provided on the circuit pattern.
Embodiments of the present description relate to the field of fabricating microelectronic substrates. The microelectronic substrate may include a trace routing structure disposed between opposing glass layers. The trace routing structure may comprise one or more dielectric layers having conductive traces formed thereon and therethrough. Also disclosed are embodiments of a microelectronic package including a microelectronic device disposed proximate one glass layer of the microelectronic substrate and coupled with the microelectronic substrate by a plurality of interconnects.
A method of fabricating a capacitance touch panel module includes forming a plurality of first conductive patterns on a substrate comprising a touching area and a peripheral area along a first orientation, a plurality of second conductive patterns along a second orientation, and a plurality of connecting portions in the touching area; forming a plurality of insulated protrusions, in which each insulated protrusion covering one connecting portion, and forming an insulated frame on the peripheral area; and forming a bridging member on each insulated protrusion.
A display panel of an embodiment of the present invention includes a wiring board , a counter substrate which is provided on a viewer side of the wiring board , and a display medium layer which is provided between the wiring board and the counter substrate , wherein the wiring board includes a substrate and a plurality of metal wires provided on the counter substrate side of the substrate , and at least part of the plurality of metal wires has a moth-eye structure or inverted moth-eye structure in its surface.
A signal line that is easily inflected includes a laminated body including at least insulator layers that include flexible material and are laminated from a positive direction side in a z axis direction to a negative direction side therein in this order. A ground conductor is securely fixed to a main surface on the positive direction side of the insulation sheet in the z axis direction. A signal line is securely fixed to a main surface on the positive direction side of the insulator layer in the z axis direction. A ground conductor is securely fixed to a main surface on the positive direction side of the insulator layer in the z axis direction. The ground conductors and the signal line define a stripline structure. The laminated body is inflected so that the insulator layer is located on an inner periphery side, compared with a location of the insulator layer.
A printed circuit board is disclosed. The printed circuit board comprises a substrate having a top surface and a bottom surface. A ground plane is on the bottom surface. A signal trace is on the top surface along a first direction. At least two isolated power planes are on the top surface adjacent to opposite sides of the signal trace, respectively. A conductive connection along a second direction couples to the two power planes, across the signal trace without electrically connecting to the signal trace, wherein the signal trace doesn't pass over any split of the ground plane.
The described embodiments relate generally to use of an electrically conductive member, such as a grounding spring, used to electrically ground components on a printed circuit board as well as provide mechanical protection to the components. More particularly, a method and apparatus for attaching a grounding spring to multiple locations on the printed circuit board are disclosed. In one embodiment, the grounding spring can act as both a ground and a mechanical protection element for other surface mounted components disposed on the printed circuit board.
The present invention relates to a composite assembly of plastic and metal films which can be used for the interconnection and connection of light-emitting diodes . For this purpose, a flexible printed circuit board is provided, to which at least one radiation source is applied and which consists of a film system. The flexible printed circuit board has a thermal connection to a heat sink and the film system is composed at least of an insulating carrier layer and a metal film. The insulating carrier layer is opened at the locations at which the thermal connection to the heat sink is produced, and the metal film is subdivided into different sections.
An electronic control unit includes a board, an electronic device, a heatsink, and a fastener. The board includes a protection layer and a ground pattern covered with the protection layer. The ground pattern has an exposed portion exposed outside the protection layer. The electronic device is mounted on the board and has an anode terminal and a cathode terminal connected to the ground pattern. The heatsink supports the board. The fastener is inserted though an insertion hole of the exposed portion. The fastener electrically connects the ground pattern to the heatsink and fixes the board to the heatsink. The exposed portion is located on the cathode terminal side of the electronic device.
A plasma system includes a plasma arc torch, a cylindrical tube and an eductor. The plasma arc torch includes a cylindrical vessel having a first end and a second end, a first tangential inlet/outlet connected to or proximate to the first end, a second tangential inlet/outlet connected to or proximate to the second end, an electrode housing connected to the first end such that a first electrode is aligned with a longitudinal axis of the cylindrical vessel, and extends into the cylindrical vessel, and a hollow electrode nozzle connected to the second end of the cylindrical vessel. The cylindrical tube is attached to the hollow electrode nozzle and aligned with the longitudinal axis, the cylindrical tube having a side inlet and a radio frequency coil disposed around or embedded within the cylindrical tube. The eductor is attached to the cylindrical tube and aligned with the longitudinal axis.
An X-ray radiation device comprises a plurality of X-ray radiation units, each having an X-ray tube for generating an X-ray, a drive circuit for driving the X-ray tube, and a trunk line connected to the drive circuit, and a controller having a control circuit for controlling the X-ray radiation units. The trunk lines of the plurality of X-ray radiation units are connected in series to the control circuit so that the drive circuits of the plurality of X-ray radiation units are connected in parallel to the control circuit. Since the trunk lines of the plurality of X-ray radiation units are connected in series to the control circuit, the X-ray radiation units can be connected to each other and are not required to be connected one by one to the controller. This makes it possible to increase and decrease the number of units without complicating their wiring.
One aspect of the invention provides an energy dissipative tube including: a length of corrugated stainless steel tubing; a conductive resin layer adjacent to the outside of the tubing; and an insulative resin layer adjacent to the conductive layer. Another aspect of the invention provides an energy dissipative tube consisting of: a length of corrugated stainless steel tubing; a conductive thermoplastic polymer layer adjacent to the outside of the tubing, the conductive thermoplastic polymer layer having a volume resistivity of less than about 106 ohm-cm; and an insulative resin layer adjacent to the conductive layer.
Systems, methods and articles for providing centralized control of area lighting hours of illumination. An area illumination system includes a central control system operatively coupled to a plurality of luminaires through a data communications network. In some implementations, the data communications network may include a power-line power distribution system and/or a wired or wireless communications network. Each of the plurality of luminaires includes a local illumination control system, which may include a photosensor. The central control system identifies one or more luminaires as having a faulty local illumination control system and issues illumination commands to such luminaires through the data communications network so that the luminaires continue to operate normally without a working local illumination control system. The central control system may store data relating to luminaires having faulty illumination control systems, such as addresses, map data, routing data, or the like.
In the case where luminance of light to be irradiated onto a multi-screen is not homogenized over the entire multi-screen, each of an image display apparatus and image display apparatuses carries out a homogenizing process of light to be irradiated onto a multi-screen over the entire multi-screen.